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Panel Button
  1. 主页 /
  2. 嵌入式电脑 /
  3. 嵌入式工控机 /
  4. EPC-T系列 /
  5. EPC-T2000系列 /

EPC-T2000系列

EPC-T2286

适配Intel® 第8/9代 Core™ i 系列处理器，搭载H310芯片组。1U超薄高度，性能强劲。

  • 支持Intel® 第8/9代 Core™ i 处理器和H310芯片组
  • 2 x 260pin SO-DIMM，最高可达32GB DDR4 2133MHz
  • 独立双显：DP/HDMI
  • 3 x GbE LAN
  • 12V DC-IN供电，锁定式直流电源插孔
  • 1 x 2.5寸抗震硬盘托架
  • 44mm超薄设计，支持上架
  • 支持壁挂/VESA/导轨/机架安装模块
  • 支持WISE-PaaS/RMM

认证：

技术资源链接：

产品型录 技术文件下载
  • 适配Intel® 第8/9代 Core™ i 系列处理器，搭载H310芯片组。1U超薄高度，性能强劲。

规格

Thermal Solution
Thermal Solution
  • 2x chassis fan (4cm/23.8CFM each)
  • 2x chassis fan (4cm/23.8CFM each)
  • 2x chassis fan (4cm/23.8CFM each)
Processor
Compatible Motherboard
  • AIMB-286
  • AIMB-286
  • AIMB-286
CPU
  • Intel® 8th Gen. Core i Processor i5-8500T
  • Intel® 8th Gen. Core i Processor i7-8700
  • Intel® 8th Gen Core™ i processor/Pentium/Celeron (LGA1151)
BIOS
  • AMI EFI 128Mbit
  • AMI EFI 128Mbit
  • AMI EFI 128Mbit
Memory
Socket
  • 2 x 260 Pin DDR4 SO-DIMM
  • 2 x 260 Pin DDR4 SO-DIMM
  • 2 x 260 Pin DDR4 SO-DIMM
Technology
  • DDR4 2133MHz SO-DIMM
  • DDR4 2133MHz SO-DIMM
  • DDR4 2133MHz SO-DIMM
Max. Capacity
  • 32GB (up to 16GB per SO-DIMM)
  • 32GB (up to 16GB per SO-DIMM)
  • 32GB (up to 16GB per SO-DIMM)
Storage
M.2
  • B key for SSD (Type: 2242, 3042mm)
  • B key for SSD (Type: 2242, 3042mm)
  • B key for SSD (Type: 2242, 3042mm)
2.5" Drive Bay
  • 1 (support 2.5" HDD/SSD, max 9.5 mm height)
  • 1 (support 2.5" HDD/SSD, max 9.5 mm height)
  • 1 (support 2.5" HDD/SSD, max 9.5 mm height)
Graphics
Chipset
  • Intel HD Graphics
  • Intel HD Graphics
  • Intel HD Graphics
Ethernet
Controller
  • LAN1/Lan2: Realtek RTL8111H; LAN3: Intel i210AT
  • LAN1/Lan2: Realtek RTL8111H; LAN3: Intel i210AT
  • LAN1/Lan2: Realtek RTL8111H; LAN3: Intel i210AT
Connector
  • 3 (RJ-45)
  • 3 (RJ-45)
  • 3 (RJ-45)
Interface
  • 10/100/1000 Mbps
  • 10/100/1000 Mbps
  • 10/100/1000 Mbps
Audio
Chipset
  • Realtek ALC892, High Definition Audio (HD)
  • Realtek ALC892, High Definition Audio (HD)
  • Realtek ALC892, High Definition Audio (HD)
Expansion
M.2
  • 1 x B key for SSD and 3G/4G (Type: 2242/3042mm); 1 x E key for wireless (Type: 2230mm)
  • 1 x B key for SSD and 3G/4G (Type: 2242/3042mm); 1 x E key for wireless (Type: 2230mm)
  • 1 x B key for SSD and 3G/4G (Type: 2242/3042mm); 1 x E key for wireless (Type: 2230mm)
Front I/O Interface
Antenna
  • 2 (reserved )
  • 2 (reserved )
  • 2 (reserved )
Audio
  • 2 (reserved, Line-Out, Mic-In)
  • 2 (reserved, Line-Out, Mic-In)
  • 2 (reserved, Line-Out, Mic-In)
COM
  • 4 (3x RS-232, 1 x RS-232/422/485 by Bom optional, default RS-232)
  • 4 (3x RS-232, 1 x RS-232/422/485 by Bom optional, default RS-232)
  • 4 (3x RS-232, 1 x RS-232/422/485 by Bom optional, default RS-232)
USB
  • 4 (USB2.0)
  • 4 (USB2.0)
  • 4 (USB2.0)
Rear I/O Interface
DP++
  • 1
  • 1
  • 1
HDMI / DisplayPort*
  • 1/0
  • 1/0
  • 1/0
COM
  • 2 (1x RS-232, supports 5V/12V by jumper selection; 1 x RS-232/422/485 by Bom optional, default RS-232)
  • 2 (1x RS-232, supports 5V/12V by jumper selection; 1 x RS-232/422/485 by Bom optional, default RS-232)
USB
  • 4 (USB3.0)
  • 4 (USB3.0)
  • 4 (USB3.0)
Audio
  • 2 (Line-out, Mic-In)
  • 2 (Line-out, Mic-In)
  • 2 (Line-out, Mic-In)
Antenna
  • 2 (reserved )
  • 2 (reserved )
  • 2 (reserved )
Ethernet
  • 3 (RJ-45)
  • 3 (RJ-45)
  • 3 (RJ-45)
Power Input
  • 1 (DC Jack)
  • 1 (DC Jack)
Miscellaneous
LED Indicators
  • 2 (Power LED, HDD LED)
  • 2 (Power LED, HDD LED)
  • 2 (Power LED, HDD LED)
Control
  • 1 (Power Switch); 1 (Remote Power Jack)
  • 1 (Power Switch); 1 (Remote Power Jack)
  • 1 (Power Switch); 1 (Remote Power Jack)
Power Requirement
Voltage
  • 12V DC-in
  • 12V DC-in
  • 12V DC-in
Power Consumption
  • Minimum 81.9W with i5-8500T
  • Minimum 114W with i7-8700
  • Minimum 81.9W with i5-8500T
Environment
Humidity
  • 10 ~ 95% @ 40° C, non-condensing
  • 10 ~ 95% @ 40° C, non-condensing
  • 10 ~ 95% @ 40° C, non-condensing
Non-Operational Temperature
  • -20 ~ 60° C (-4 ~ 140° F)
  • -20 ~ 60° C (-4 ~ 140° F)
  • -20 ~ 60° C (-4 ~ 140° F)
Operating Temperature
  • 0 ~ 50 °C (HDD SPEC: 0~ 65 °C with 0.7m/s air flow)
  • 0 ~ 50 °C (HDD SPEC: 0~ 65 °C with 0.7m/s air flow)
  • 0 ~ 50 °C (HDD SPEC: 0~ 65 °C with 0.7m/s air flow)
Vibration Resistance
  • 0.5G (Slim 2.5" HDD) / 3G (2.5" SSD/ M.2 storage)
  • 0.5G (Slim 2.5" HDD) / 3G (2.5" SSD/ M.2 storage)
  • 0.5G (Slim 2.5" HDD) / 3G (2.5" SSD/ M.2 storage)
Weight (kg)
Weight (kg)
  • 3.98kg
  • 3.98kg
  • 3.98kg
Dimensions
Dimensions (W x H x D)
  • 250 x 44.2 x 225 mm (9.84" x 1.74" x 8.85")
  • 250 x 44.2 x 225 mm (9.84" x 1.74" x 8.85")
  • 250 x 44.2 x 225 mm (9.84" x 1.74" x 8.85")
Embedded OS
OS Support
  • Optional
  • Optional
  • Optional

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